CPU, GPU and other applications between power semiconductor components and heat sinks.
For high demanding applications – new large 30 gram package of MX-2
MX-2 is a high thermal conductivity and low thermal resistance compound for components that require optimum thermal dissipation. It is ideally suited for use in CPU, GPU cooling and other applications between power semiconductor components and heat sinks where thermal conductivity is the major factor.
- High Thermal Conductivity
- Low Thermal Resistance
- Non-Electrical Conductive
- No Curing
- No Bleeding
Safe to apply anywhere
Since the MX-2 does not contain any metal particles, there are no problems regarding electrical conductivity or capacitance. Unlike other silver and copper compounds, MX-2 ensures that contact to electrical circuits, pins and leads cannot result in any damage.
With MX-2 no curing and no bleeding of the compound are possible. In contrast to other products, this compound does not show decreasing performance over time, does not need to be reapplied and has a durability of at least 8 years.
- Tested with: Intel Core 2 Duo E6300 overclocked at 2.8GHz.
- Data source: MVKTech http://www.mvktech.net/content/view/3568/
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|Density:||3.35 g/ cm3|
|Net Weight:||30 gram|